1

Mechanisms of Scaling Effect for Emerging Nanoscale Interconnect Materials

zutlijtf57c2cw
The resistivity of Cu interconnects increases rapidly with continuously scaling down due to scatterings. causing a major challenge for future nodes in M0 and M1 layers. Here. A Boltzmann-transport-equation-based Monte Carlo simulator. https://www.knowall.blog/
Report this page

Comments

    HTML is allowed

Who Upvoted this Story